Hermetic encapsulation with epoxy moulding compounds from Duresco
Combining low viscosity with outstanding crack resistance, Duresco thermosets are ideal for hermetically encapsulating a range of materials. Furthermore, since they are injected at low pressures, it is possible to incorporate additional electronic components in the course of a single production process. Epoxy moulding compounds from Duresco guarantee reliable, long-term service under challenging climatic conditions.
BENEFITS DURING PROCESSING
- Moderate injection pressures
- High flow-path/wall-thickness ratios
- Moulding temperature adjusted to inserts
- Limited mould shrinkage and minimal post-mould shrinkage
- No post-curing required
BENEFITS IN END PROPERTIES
- Good adhesion to inserts
- Low water absorption combined with outstanding chemical resistance
- Hermetic encapsulation
- High thermal shock resistance
- High thermal shock resistance
CONTACT
Hans-Fred Buchmann
+41 61 726 62 20
hans-fred.buchmann@duresco.ch
