LASER STRUCTURING FOR 3D MID
Challenge
- The use of 3D MID technology to produce injection-moulded substrates with a higher integration of electronic circuitry.
Solution
- Duresco develops materials with the following characteristics:
- Suitable for laser structuring without additives
- Maximal adhesion between substrate and copper coating
CONTACT
Philip Willis
+41 61 726 62 10
philip.willis@duresco.ch